Wafer Thinning System Ulucus™ G Series
Contributing to the wafer fabrication process by integrating new technology into a highly reliable platform
The Ulucus™ G series of semiconductor production equipment integrates TEL’s market-leading and production-proven Coater/Developer platform technology with several other advanced technologies, including wafer cleaning.
Advanced patterning in semiconductor manufacturing requires increasingly higher flatness in silicon wafers. The trend of global labor shortages escalates the favorability of integrated wafer fabrication equipment that can perform multiple processes continuously and automatically.
TEL anticipates significant performance improvement of semiconductors and wafer fabrication and has introduced high-volume processing systems equipped with innovative technologies to address the customers’ production needs.
Ulucus™ G is the new wafer thinning system enabling the fabrication of higher quality silicon wafers while reducing the manpower needed for mass production. The new system integrates an originally developed grinding unit with the LITHIUS Pro™ Z platform that has been fully production-proven in coater/developer applications.
Ulucus™ G integrates the newly developed grinding unit, a scrub cleaning unit and a spin wet etch unit. All of these are single-wafer processing units which allows control over the quality of each wafer.
Inspection units can also be incorporated into the system, enabling in-system feedback and feedforward of process metrics for realizing high flatness, clean, and low damage wafer fabrication without relying on human skills.
Ulucus is a registered trademark or trademark of Tokyo Electron Group in Japan and/or other countries.
